Samsung Automates Semiconductor Packaging
The traditional semiconductor packaging production line usually needs a large amount of manpower. Samsung Electronics has set a goal of converting its packaging plants to be human labour-free by 2030.
India Screens Samsung Electronics For Its Product Linked Incentive (PLI) Application
iPhone production and exports surge had Taiwan-based manufacturers in India quickly request Product Linked Incentive after meeting the incentive targets. However, competitor Samsung is not having a smooth process in getting the payout.
Samsung Envisions Hyper-Growth in Memory and Logic Semiconductors Through Intensified Industry Collaborations
A new wave of memory solutions and limitless partnership opportunities to bring greater capabilities to data center, server, mobile, gaming and automotive markets.
Vietnam’s Battle To Climb The Global Value Chain
The country earns global factory status but fears it will remain an ‘assembly platform’.
Samsung To Produce Semiconductor Parts In Vietnam In 2023
Samsung is strengthening its international supplier network and trying to expand its manufacturing operations in more countries. According to Vietnamese media Lao Dong, Samsung’s Roh Tae-Moon met with Vietnamese Prime Minister, Pham Minh Chin, to prepare for what comes next.
The Hidden Suppliers of the Chip Industry
Since the start of the pandemic, chip shortages have majorly impacted the automotive, information technology and consumer electronics sectors, partly due to disruptions in production processes and supply chains amid increased demand.
Samsung Electronics Selects Optomec Additive Manufacturing System for Next-Gen Electronics Production
Samsung Electronics has commissioned Optomec’s additive manufacturing (AM) system—the Aerosol Jet 5X System—in its Printed Electronics Lab to enable next-generation electronics production.
Aerosol Jet can print conductors and dielectric materials on 3D surfaces on many types of substrates. Electronics manufacturers are now using the Aerosol Jet process to print RF interconnects, replace wire bonds in IC packaging, print antennas directly onto electronics enclosures and create multilayer, miniature circuits—essentially eliminating the restrictive shapes of PCBs. These capabilities will enable Samsung Electronics designers to miniaturize products as well as change the form of the overall electronics package, allowing more organic and ergonomic designs.
The Optomec Aerosol Jet 5X system supports five-axis of coordination motion with a 200x300x200mm (x, y, z) print envelope, and has the ability to print features ranging from 10 microns to millimetres. In addition to the hardware and software of the Aerosol Jet System, Optomec provides two decades of materials and process research to match the performance and environmental requirements of the design to a proven production-ready process.
Check these articles out:
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● Seco Tools: Prevent Delamination In Hybrid Stacked Material Machining
● Manufacturing Growth In Singapore Moderates After Eight-Year High
● Siemens’ Additive Manufacturing Tour, Hannover Messe 2018
● Walter Tools Releases White Paper on Dynamic Milling
● Taking metal to the cloud
● Optomec Partners With Tongtai To Deliver Hybrid Machines
● Etihad Engineering Sets Up 3D printing Lab in Abu Dhabi, Receives Region’s First Approval to 3D Print Aircraft Parts
● igus Coating Technology Makes Abrasion-Resistant Metal Components
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