Samsung Swaps Executive To Tackle ‘Chip Crisis’ Amid AI Boom
Samsung Electronics swapped its Chief of Semiconductor Division in a bid to overcome a “chip crisis”, amid a booming market for AI chips where the world’s biggest memory chipmaker has lagged peers.
ASML Secret Sauce For Semiconductor Success Amid Challenges In The Angstrom Era
Moore’s Law is not advancing as fast as it used to be under 2nm and even into the Angstrom level, and competitors are trying to catch up. Can ASML continue its monopolistic leadership in the extreme ultraviolet (EUV) lithography equipment market?
Vietnam Versus Malaysia For Semiconductor Design Hub Crown
Vietnam competes head-on for the same crown of semiconductor design focal point after Malaysia’s declaration to be an integrated circuit design hub.
Indonesian Minister for Economic Affairs Acknowledges Lack In Microelectronics Knowledge
Coordinating Minister for Economic Affairs, Airlangga Hartarto recognised the country needs strong microelectronics knowledge to compete in the global semiconductor market, The Antara News reported.
TTM Technologies Celebrates Grand Opening Of Its First Manufacturing Facility In Penang
TTM Technologies’ new facility is designed to meet the growing need to improve the resilience of the printed circuit board supply chain and expand geographic diversity.
Malaysia Plans Southeast Asia’s Largest Integrated Circuit Design Park
Malaysia plans to build Southeast Asia’s largest integrated circuit design park and will offer incentives including tax breaks, subsidies and visa exemption fees to attract global tech companies and investors, the government said on 22 April 2024.
An Opportunity For Korean Semiconductor Players?
The recent 7.4 magnitude earthquake that struck Taiwan seemed to have spelt an opportunity for Korea to catch up on the semiconductor race.
AST Begins Constructing Singapore Facility For High-End Substrates & Advanced Technologies
Advanced Substrate Technologies Pte. Ltd. (AST) broke ground for the construction of its new factory on Pesawat Drive near Jurong Lake District, on 14 March 2024 to manufacture high-end FC-BGA substrates used in bleeding edge semiconductor products such as Network Switches and Artificial Intelligence (AI) / Machine Learning (ML) devices.
